Taiwan Semiconductor Manufacturing Company (TSMC) has officially announced that its A14 (1.4nm) and A16 manufacturing processes will forgo the adoption of High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography technology. This decision stands in stark contrast to Intel, which is actively embracing this cutting-edge technology. TSMC's choice to utilize Low NA multiple exposure technology is primarily motivated by cost-effectiveness considerations, as High NA EUV equipment carries a staggering price tag of $385 million. Despite this, TSMC intends to introduce back-side power delivery technology for its A14P chip, set for release in 2029, and has suggested that a subsequent A14X model might be a contender for the integration of High NA EUV technology. This strategic move underscores TSMC's thoughtful balancing of technological innovation with economic viability.