TSMC, often a trailblazer in the semiconductor industry, has opted to forgo the high numerical aperture EUV lithography equipment for the A14 process. Instead, the company has chosen to utilize the traditional 0.33 numerical aperture EUV technology. This strategic shift is primarily motivated by cost-saving measures. The high numerical aperture EUV equipment is prohibitively expensive, whereas the A14 chip design can meet the necessary precision standards with traditional technology, thereby lowering production costs.
