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SK Hynix Pioneers the Unveiling of First-Batch HBM4 Memory Technology
2025-04-28 /
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Author：小编
During TSMC's North America Technology Forum, SK Hynix proudly presented its cutting-edge HBM4 high-bandwidth memory technology tailored for AI applications, along with the launch of several groundbreaking new products. The HBM4 boasts an impressive single capacity of up to 48GB, a bandwidth of 2.0TB/s, and an I/O speed of 8.0Gbps, with plans for mass production slated for the latter half of 2025. Positioning itself as the pioneer in disclosing detailed specifications of HBM4, SK Hynix precedes industry giants Samsung and Micron. Furthermore, SK Hynix has introduced the pioneering 16-layer stacked HBM3E product, reinforcing its dominance in the high-end memory sector.
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