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ESWIN Publishes Patent for Innovative Edge Grinding Control Method and Device
2025-04-27 /
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Author：小编
On February 28, 2025, Xi'an ESWIN Material Technology Co., Ltd. announced the publication of its patent titled 'Control Method and Edge Grinding Device for Edge Grinding Equipment,' with application publication number CN119526254A. This groundbreaking patent introduces a solution that efficiently monitors the precision of grinding wheels during the edge grinding process of silicon wafers. It promptly detects any abnormal deviations, minimizes edge irregularities caused by precision issues with the grinding wheel, and significantly enhances the stability of edge process parameters for silicon wafers.
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