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Advanced Semiconductor Manufacturing Co., Ltd. Unveils Patent for "Optoelectronic System Packaging Structure and Preparation Technique"
2025-04-24 /
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Author：小编
Advanced Semiconductor Manufacturing Co., Ltd. (Jiangyin) has proudly announced the acquisition of a patent for "Optoelectronic System Packaging Structure and its Preparation Method," bearing the application publication number CN119581346A and published on March 7, 2025. This groundbreaking patent aims to revolutionize optoelectronic integration through innovative packaging architectures and fabrication processes, potentially encompassing advancements such as miniaturizing package dimensions, reducing power consumption, and bolstering system reliability.
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