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HJ Semiconductor's Patent on 'Redistribution Structure Preparation and Design' Officially Published
2025-04-24 /
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Author：小编
HJ Semiconductor Packaging Pioneering Technology R&D Center Co., Ltd. has announced the publication of its patent titled 'Preparation Method and Redistribution Structure of a Redistribution Structure' on March 7, 2025, bearing the publication number CN119581343A. This achievement underscores the company's prominence, having been recognized as a national-level service-oriented manufacturing demonstration platform and honored with the prestigious 'Wuxi May 1st Labor Medal'.
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