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SCH-SEMI Unveils Patent for Innovative "Back-side Power Supply Chip Packaging Structure and Preparation Method"
2025-04-22 /
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Author：小编
SCH-SEMI (Jiangyin) Co., Ltd. has proudly announced the issuance of a patent for their groundbreaking "Back-side Power Supply Chip Packaging Structure and its Preparation Method," bearing the application publication number CN119581347A and a publication date of March 7, 2025. This innovative patent leverages back-side power supply technology to significantly enhance the chip packaging structure, resulting in a reduction in both packaging thickness and size. Additionally, it缩短传输距离并降低功耗， thereby boosting efficiency and performance.
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