Oulai New Materials Unveils Patent for Innovative 'Preparation Method of Copper Electroplating Seed Layer for HJT Photovoltaic Cells' - Chip

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Oulai New Materials Unveils Patent for Innovative 'Preparation Method of Copper Electroplating Seed Layer for HJT Photovoltaic Cells'

2025-04-19 / Read about 0 minute

Author：小编

Hefei Oulai Advanced Materials Co., Ltd. has proudly announced the acquisition of an invention patent titled 'Preparation Method of Copper Electroplating Seed Layer for HJT Photovoltaic Cells'. The patent bears the application publication number CN119530714A and was published on February 28, 2025. This groundbreaking patent leverages CuNi targets in the sputtering process and innovatively incorporates CuNi seed layer films to significantly enhance the photoelectric conversion efficiency of heterojunction solar cells.

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