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AMQ Unveils Patent for Innovative Chip Packaging Method and Structure Utilizing Metal Thermal Interface Material
2025-04-19 /
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Author：小编
Changsha AMQ Intelligent Technology Co., Ltd. has proudly announced the issuance of a patent titled "A Chip Packaging Method and Structure Based on Metal Thermal Interface Material," bearing the application publication number CN119542154A and published on February 28, 2025. This groundbreaking method meticulously orchestrates the connection between metal thermal interface material, chips, and heat dissipation covers, thus efficiently mitigating material overflow, diminishing the likelihood of device short circuits, enhancing thermal conductivity, and significantly boosting packaging reliability.
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