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During TSMC's first-quarter earnings conference on April 17, Chairman Wei Zhejia revealed that the company intends to significantly boost its investment in the United States, with a total commitment of $100 billion. This substantial investment will facilitate the construction of three new wafer fabs, two advanced packaging facilities, and one R&D center. Upon completion, it is anticipated that the Arizona plant will account for 30% of TSMC's advanced process capacity for technologies below 2nm. Wei Zhejia emphasized that the US market harbors robust demand for AI, with key clients such as Apple, NVIDIA, AMD, Qualcomm, and Broadcom demanding additional capacity support. Consequently, TSMC has opted to expand its manufacturing capabilities to meet these requirements.
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