On March 19, SK Hynix announced the launch of its groundbreaking 12-layer HBM4, a cutting-edge DRAM solution tailored for AI applications. For the first time, the company has supplied samples of this ultra-high-performance product to leading global customers. Boasting the highest bandwidth and capacity in the world, mass production of HBM4 is anticipated to commence in the second half of the year. SK Hynix underscores that this initiative will further cement its position as a leading player in the AI memory market.
