On March 18th, the esteemed tech blog MacRumors unveiled intriguing details about the upcoming iPhone 18 series, even before the current iPhone 17 series has hit the market. At the heart of this anticipation lies the chip that will power these devices. According to analyst Jeff Pu, the A20 chip destined for the iPhone 18 series will adhere to TSMC's advanced second-generation 3nm process (N3P), potentially offering modest performance enhancements. Notably, Apple intends to integrate CoWoS packaging technology, a strategic move aimed at bolstering its AI capabilities. It is projected that the first iPhone chip to leverage the groundbreaking 2nm process will make its debut in 2027.
