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Taiwan Semiconductor Manufacturing Company (TSMC) intends to establish Fab 25 in the Salun District of Tainan, Taiwan. This facility is anticipated to encompass six production lines, where lines P1 through P3 will employ 1.4nm process technology, and lines P4 to P6 will adopt the groundbreaking 1nm process technology. With Taiwan serving as its primary hub, TSMC boasts research and development centers, 12-inch wafer fabrication plants, and state-of-the-art packaging facilities worldwide. Currently, R&D efforts on the 1.4nm process technology A14 are in full swing, with a projected launch window between 2027 and 2028. Additionally, the 2nm process technology is poised for mass production by the end of 2025, followed by its enhanced variants, N2P and 1.6nm process technology A16, which are expected to enter mass production by the end of 2026.
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