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In a recent report, Ming-Chi Kuo, a noted analyst at TF International Securities, revealed insights from the latest supply chain survey concerning TSMC's groundbreaking advanced packaging technology, COUPE. The survey highlights a marked enhancement in the development and supply chain transparency surrounding COUPE. Notably, Himax Technologies has been solidified as the sole provider of the first and second-generation micro-lens arrays essential for this technology.
Currently, the first generation of COUPE has been successfully developed and has progressed to the mass production verification phase. Looking ahead, the second generation is anticipated to commence its mass production verification in the first half of 2026. Among TSMC's esteemed clientele, AMD stands out as the potential first adopter of this cutting-edge COUPE technology.
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