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Taiwan Semiconductor Manufacturing Company (TSMC) is rapidly expanding its advanced packaging technology, CoWoS, and is rumored to be constructing two new factories in the Southern Taiwan Science Park Phase III, with an anticipated investment exceeding NT$200 billion. The administration of the Southern Taiwan Science Park has confirmed that TSMC has submitted an application for land lease, but has declined to disclose any specific development plans. During a recent investor conference last week, TSMC Chairman Mark Liu disclosed that the company intends to further expand its CoWoS production capacity. Industry analysts speculate that this substantial investment by TSMC is likely in response to the surging demand for high-performance computing (HPC) related orders from major clients, including NVIDIA.
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