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AMD to Utilize TSMC's 3nm Process for Zen 6 CCD, While Opting for 4nm for Next-Gen cIOD and sIOD
2025-01-17 /
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Author：小编
Based on reputable rumors circulating on the Chiphell forum, known for its accurate insights into AMD-related developments, AMD intends to manufacture the core complex die (CCD) of its forthcoming Zen 6 microarchitecture using TSMC's advanced 3-nanometer N3E process node. Should these rumors prove true, it underscores a renewed collaboration between AMD and TSMC, leveraging the exceptional performance and power efficiency of the N3E process to innovate the Zen 6 chip architecture, thereby advancing the semiconductor industry's frontier.
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