JCET has recently been granted a patent for the 'Packaging Structure and Preparation Method of Ultra-small Image Acquisition and Processing System,' bearing the authorization number CN115696082B and dated December 10, 2024. The patent application was submitted on November 11, 2022. This patent revolves around the integration of components like optical coated glass and CMOS chips into a compact structure, leveraging advanced packaging technology to achieve a unified packaging solution. This innovation not only simplifies the system and reduces power consumption but also enhances the image's anti-interference capability.
