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Micron Enters 16-Hi HBM3E Memory Race, Aims for Mass Production This Year
2025-01-16 /
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Author：小编
Micron Technology is intensifying its market presence in the realm of 16-layer stacked HBM3E memory, aiming to commence mass production within the year. This strategic move aims to bolster its competitive edge in the high-performance memory market. With SK Hynix having already launched a 48GB 16-Hi HBM3E memory solution and Samsung Electronics ramping up its mass production, Micron is determined to elevate its HBM market share to 20% and expand its global production capabilities. Notably, Micron's new HBM packaging facility in Singapore is anticipated to become operational by 2026, further underscoring the company's commitment to this advanced memory technology.
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