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NVIDIA CEO Jen-Hsun Huang to Tour SPIL's New Facility; TSMC Accelerates CoWoS Packaging Outsourcing for Mass Production
2025-01-15 /
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Author：小编
NVIDIA Chief Executive Officer Jen-Hsun Huang will grace the opening ceremony of SPIL's new plant in Taichung. SPIL and NVIDIA enjoy a longstanding partnership in the realm of post-semiconductor packaging and testing. Amidst the surging demand for advanced CoWoS packaging from NVIDIA's AI chips and TSMC's capacity constraints, TSMC is augmenting its CoWoS capabilities and outsourcing a portion of the packaging and testing processes to SPIL and ASE. SPIL's oS process has already been certified, paving the way for anticipated mass production to commence in the second quarter of this year.
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