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MEMSensing Granted Patent for Innovative "Chip Packaging Structure"
2025-01-13
Suzhou MEMSensing Microelectronics has recently been awarded a patent, bearing the authorization number CN222159754U, for its groundbreaking "Chip Packaging Structure." This patent is aimed at enhancing the yield and bonding quality of MEMS chips by addressing potential challenges in metal bonding through a unique structural design. This cutting-edge technology not only boosts production efficiency but also fortifies the market competitiveness of MEMS chips, thereby positively impacting the smart device market.
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