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Defu Technology: Ultra-Premium Carrier Copper Foil Products Verified by Leading Storage Chip Company
2025-01-12
Defu Technology specializes in the research, development, and sales of high-performance electrolytic copper foil. Its ultra-premium carrier copper foil has successfully undergone verification by a leading storage chip company, setting the stage for potential import substitution by 2025. Already, the company's products have displaced imports in the domestic high-frequency communication and high-speed server markets, with applications extending to NVIDIA projects. By 2025, it is anticipated that shipments of these products for high-frequency and high-speed PCB, as well as AI application terminals, will reach several thousand tons.
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