Samsung Electronics is teaming up with AMD to upgrade its next-generation semiconductor manufacturing test infrastructure. As part of this collaboration, Samsung will integrate AMD's latest Zen 6-based EPYC Embedded 9006 Series SP7 processors into its testing systems, pairing them with Samsung DDR5 memory, PCIe 6.0 SSDs, and CXL memory modules to boost data processing capability and computational efficiency for chip testing. These processors offer up to 256 cores and 512 threads, delivering up to 1.8x higher throughput than the previous generation, along with up to 2.7x greater memory bandwidth and up to 1.5x improved I/O bandwidth—making them well-suited for scenarios such as semiconductor automated test equipment. The 128-core version is set to ship on November 15, with the remaining models rolling out gradually before the end of the year. With product lifecycle support of up to seven years, these processors can meet Samsung's growing need for higher test computing power and bandwidth for next-generation storage devices, helping ensure test efficiency and product validation cycles.