Search
Huawei Unveils First "Logic Folding" τ Chip: Kirin 9050 Series Core Upgrades Detailed, Transistor Density Jumps 53.5%
2 hour ago /
Read about 0 minute
Author：小编
Huawei has launched its first τ chip, the Kirin 9050 series, featuring "Logic Folding" technology. Built around upgrades to eight core units, the chip boasts over 50 million hybrid bonds, more than 5 million effective signal interconnects, and a 53.5% increase in transistor density. The Kirin 9050 Pro integrates the Lingxi CPU, Maleon GPU, and Da Vinci architecture NPU, delivering significant improvements in performance and energy efficiency across all core units. It also comes equipped with components including the Kirin AI ISP, Lingxi micro-core, FFTS function flow task scheduler, and security processor. The related detailed architecture diagrams were unveiled for the first time at the 2026 Kirin Media Communication Conference.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
