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Report: Samsung Electronics Aims to Complete Development of Advanced Packaging Technology "3D Cube-H" by Early Next Year
7 hour ago /
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Author：小编
Samsung Electronics plans to complete development of its advanced packaging technology, 3D Cube-H, for ultra-high-performance AI chips by early next year. The technology employs hybrid bonding with a terminal pitch of approximately 6μm—significantly smaller than the 25μm of traditional thermal compression bonding—and is capable of increasing connection density, reducing energy consumption per bit, and improving heat dissipation. After launching its first design kit, the company will conduct evaluations with potential customers. If development succeeds, Samsung is expected to secure large customer orders for its foundry business.
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