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Hongda Electronics Plans to Raise Up to 1 Billion Yuan in Private Placement for Tantalum Capacitor and Ceramic Thin-Film Circuit Projects
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Author：小编
Hongda Electronics has announced plans to issue A-shares to specific investors, aiming to raise no more than 1 billion yuan. After deducting issuance expenses, the proceeds will fund the industrialization of chip polymer tantalum capacitors and the industrialization of ceramic thin-film circuits and SLCs. The tantalum capacitor project involves a total investment of 581 million yuan, with 530 million yuan expected from the raised funds. The ceramic thin-film circuit and SLC project requires a total investment of 502 million yuan, with 470 million yuan planned from the raised funds.
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