According to a November 3 report by South Korea's Maeil Business Newspaper, Samsung Electronics will manufacture high-bandwidth memory base dies for AMD and Nvidia at its second wafer foundry in Taylor, Texas. Construction on the facility is expected to begin this month. Spanning approximately 2.7 million square feet—1.5 times the size of the first fab—the facility will utilize a 2-nanometer process. Its entire capacity has already been booked with orders, the majority of which come from AMD. The fab plans to begin equipment installation in February 2029 and to commence mass production in 2030. Samsung's first fab has already secured a contract with Tesla.