During its earnings briefing, Dongshan Precision announced that the company has achieved small-batch external sales of optical chips this year; however, in order to prioritize ensuring self-use, it has not yet carried out large-scale external sales. Large-scale external sales will depend on the pace of adoption of next-generation technologies such as in-rack interconnect, and demand is expected to gradually ramp up going forward. The company has completed preparations for optical chip production capacity and plans to simultaneously begin external sales of optical modules and optical chips starting from a specific point in the future. In Q3 of this year, 1.6T products were mainly used for customer testing and validation; starting in Q4, they will enter the relatively high-volume shipment stage. DSP still faces delivery pressure in recent quarters, and it is expected that this will improve significantly once wafer capacity is released later, without affecting deliveries next year. Currently, DSP supply is allocated by share. The company is in an incremental stage of rapid customer expansion and has certain relative advantages.