Montage Technology announced that, as of October 26, 2026, its backlog of interconnect chip orders scheduled for delivery in the fourth quarter of 2026 totaled between RMB 2.50 billion and RMB 2.79 billion. The increase was driven primarily by robust demand for DDR5 memory interconnect chips. JEDEC is currently advancing discussions on DDR6 memory interconnect technology and product standards; DDR6 RDIMMs are expected to be configured with two RCD chips, and the company expects the market for memory interconnect chips to continue expanding over the long term. The company's PCIe 6.0 Retimer chip has completed tape-out of its mass-production version and is undergoing customer testing and validation, and was recently added to the PCI-SIG Integrators List. Volume shipments of the product are expected to ramp up gradually as standard server CPU platforms supporting it enter mass production in 2027 and the broader system ecosystem matures. In parallel, the company is advancing R&D on its PCIe 7.0 Retimer chip and plans to complete engineering sample tape-out within the year.