On November 2, Montage Technology noted during a targeted survey that AI Agent applications require more CPUs to be deployed, and their workload characteristics also necessitate an increase in the number of modules to enhance channel utilization and effective bandwidth. Meanwhile, the new generation of CPUs offers more memory channels at the hardware level to meet industry demand. The growing use of memory modules will drive expansion of the global memory interconnect chip market. In addition, JEDEC continues to discuss DDR6 memory interconnect technology and product standards. According to public information from relevant manufacturers, DDR6 RDIMMs are expected to feature two RCD chips. From a longer-term perspective, the market size of memory interconnect chips will further grow.