On November 1, South Korean media reported that Samsung Electronics Chairman Lee Jae-yong visited the Advanced Packaging Lab (APL) in Yokohama, Japan, to inspect the R&D progress of next-generation semiconductor packaging materials and process technologies. He also discussed with local researchers ways to strengthen cooperation with Japanese companies in semiconductor materials, components, and equipment. Samsung Electronics established the APL in Yokohama in 2023 and plans to invest 40 billion yen (approximately 254 million USD) over five years starting in 2024 to develop the Yokohama APL into a global advanced packaging R&D center. The company also plans to expand its local R&D staff to more than 100 by 2027, with research areas to be expanded to next-generation packaging technologies such as wafer bonding and glass substrates.