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On October 25th, Jiangsu Proway, a holding subsidiary of Suntak Technology, officially broke ground on its AI edge-side chip substrate project in Qiandeng Town, Kunshan City. Boasting a total investment of 1 billion yuan, this project is dedicated to the research, development, and production of sensor chip substrates and SiP (System in Package) substrates. These efforts will offer vital support for applications in edge-side AI, AI-driven smart wearables, and intelligent robots. Once fully operational, the project is anticipated to achieve an annual output value of 1 billion yuan. The project has reached significant milestones, including signing the agreement, acquiring the land, initiating construction, and being included in the statistics—all within the same year. It is set to bridge the gap in the domestic high-end chip substrate market segment.
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