Search
Blurring Boundaries Between Wafer Foundries and OSAT: Advanced Packaging as the Convergence Point, with 2.5D and Panel-Level Packaging Leading the Way
2 day ago /
Read about 0 minute
Author：小编
The traditional division of labor between wafer foundries and Outsourced Semiconductor Assembly and Test (OSAT) providers has been clear: the former is responsible for wafer manufacturing, while the latter handles packaging and testing. However, as OSAT providers acquire some foundry capabilities and foundries reclaim some of the business originally outsourced to OSAT, the boundaries between the two are gradually blurring.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
