On October 23, BIWIN released a statement to shed light on the latest industry trends and its current production and operational status. Beginning in 2026, as the construction of artificial intelligence (AI) computing infrastructure continues to progress and the demand for storage from global data centers and cloud service providers escalates, prices of key storage products like DRAM and NAND Flash have witnessed a notable surge. This trend has significantly enhanced the overall industry's prosperity. BIWIN remains committed to its dual-pronged strategy of 'storage + wafer-level advanced packaging and testing,' expediting the development of wafer-level advanced packaging and testing manufacturing projects. The company is concentrating on cutting-edge domains such as advanced storage, memory-computing integration, and high-speed optoelectronic interconnects. It is persistently advancing the research and development, as well as the industrial application, of advanced packaging technologies including FOMS, CMC, and OEC. Simultaneously, BIWIN is actively exploring new markets, particularly those emerging in the AI computing infrastructure sector. BIWIN holds a positive outlook on the medium- to long-term storage market opportunities that will arise from the growth of the AI industry. The company intends to fully capitalize on its technological expertise and industrial synergies in storage solutions, chip design, and advanced packaging and testing to seize the industry's development prospects proactively.