On October 16, 2026 Beijing Time, Japan's Ministry of Economy, Trade and Industry approved TSMC's plan to produce 3-nanometer process semiconductors at its second plant in Kumamoto Prefecture, marking Japan's first foray into manufacturing 3-nanometer chips. Under the new plan, the monthly production capacity for 3-nanometer chips will be 6,000 wafers, with production expected to commence in December 2028.
