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Sanjia Technology: Ongoing Progress in Fan-Out Wafer Level Packaging R&D
6 day ago /
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Author：小编
On October 13, during the 2026 semi-annual performance briefing held on the very same day, Sanjia Technology disclosed that its research and development (R&D) efforts concerning Fan-Out Wafer Level Packaging are steadily progressing. Nevertheless, prior to transitioning into mass production and subsequent R&D phases, the product still confronts a multitude of technical hurdles and market uncertainties.
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