GlobalFoundries (GF) has released the FDX Fusion Fully Depleted Silicon-On-Insulator (FD-SOI) process roadmap, aimed at providing low-power, highly integrated chips for physical AI devices such as robots, automobiles, and industrial automation. The first-generation FDX Fusion is expected to achieve 7nm-class digital performance, with mass production scheduled to begin in 2028 at the Dresden facility in Germany. By incorporating an insulating layer beneath the silicon layer and supporting back-bias adjustment, this process enables flexible adjustments between power consumption and performance based on workload, helping to reduce leakage, optimize energy efficiency, and is suitable for integrating RF, analog, and digital circuits. The new platform also plans to integrate embedded non-volatile memory, in-memory computing, and high-density logic to further enhance chip performance.