Recently, the Energy Conversion and Thermal Control Team from the School of Materials Science and Engineering at the University of Electronic Science and Technology of China has achieved notable advancements in the design of thermal interface materials and the development of high-performance heat dissipation surfaces. Leveraging vertical graphene array interface interlocking technology, the research team successfully formulated a thermal interface material that integrates high thermal conductivity with minimal contact thermal resistance. This innovative material boasts an impressive out-of-plane thermal conductivity of 621.4 W m^-1K^-1 and a contact thermal resistance as low as 41.7 mm²K W^-1, thereby significantly boosting the heat dissipation performance of electronic devices. Furthermore, the team introduced a hierarchical metal-oxide composite structure approach, which elevated the emissivity of the heat dissipation surface to exceed 0.95. This enhancement enables a temperature drop of over 18°C for heat sources under natural convection conditions. The relevant research findings have been published in internationally renowned journals, including Advanced Functional Materials and the Chemical Engineering Journal.