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Analysts Say Intel's Foveros Advanced Packaging Technology May Win Another Major Foundry Business
18 hour ago /
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Author：小编
Intel's wafer foundry business may see significant collaboration. According to Jeff Pu, an analyst at GF Securities in South Korea, Nvidia may adopt Intel's Foveros advanced packaging technology for some of its new-generation AI chips starting from the second half of 2028. This indicates that even if Intel finds it temporarily difficult to fully surpass TSMC in the field of advanced logic processes, it still has the opportunity to enter Nvidia's next-generation chip supply chain through advanced packaging technology.
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