According to industry sources in South Korea, SK Hynix, a global leader in the high bandwidth memory (HBM) market, has encountered challenges in the development of hybrid bonding technology and may have fallen behind its competitor, Samsung Electronics, in progress. Currently, SK Hynix has not yet initiated the production of HBM samples based on hybrid bonding technology, while Samsung has already provided HBM samples manufactured using this technology to its customers. Hybrid bonding technology permanently bonds two silicon chips into one by embedding metal bumps, eliminating traditional bumps and directly bonding copper interconnects, thereby shortening transmission distances, reducing latency and signal distortion. It is a key process for next-generation HBM stacking. If the news is true, this will pose a setback for SK Hynix, which has long held the top global market share in HBM revenue. Currently, in shipments dominated by HBM3E and HBM4, SK Hynix leads with a 50% share, while Samsung accounts for 33%, but Samsung is accelerating its pursuit. The delay in the progress of hybrid bonding technology may cause SK Hynix to lose some of its advantages in front of customers seeking higher capacity and performance.