On September 28, the wafer fabrication facility of XianDao Optoelectronics Technology (Wuhan) Co., Ltd., a subsidiary of Vital Technology Group, officially commenced operations within the Wuhan East Lake Comprehensive Bonded Zone. This facility serves as the pivotal manufacturing hub for the high-end compound semiconductor material and chip industrialization base, a project undertaken by Vital Technology Group with a substantial investment of 12 billion yuan.

The new fab is equipped with a large-scale optoelectronic chip platform that accommodates both 4-inch/6-inch indium phosphide and 6-inch/8-inch gallium arsenide dual-material technologies, reflecting the cutting-edge advancements in semiconductor manufacturing. With the start of operations, the industrialization base has shifted its focus from construction to process certification and product introduction, marking a significant milestone in its development trajectory.

Impressively, even prior to reaching full operational capacity, the base has already garnered pre-research orders from international clients. These orders are for the collaborative development of next-generation single-mode 400G optical interconnects, underscoring the global recognition and demand for XianDao Optoelectronics' innovative capabilities.