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NVIDIA CEO Jensen Huang is scheduled to meet again with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Choi Tae-won in New York on September 28, 2026, local time. This marks the second gathering of the trio, approximately two months after their initial meeting in San Francisco in July. During this meeting, High Bandwidth Memory (HBM) has emerged as a focal point of industry attention. As a core component determining the performance of NVIDIA's next-generation products, the significance of HBM continues to grow. Samsung Electronics is planning to integrate memory, wafer foundry, and advanced packaging technologies to fully enter the AI chip market, with the potential for the relationship between the two sides to expand from mere HBM supply-demand cooperation to full-scale AI chip production.
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