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Delong Laser: Secures Small-Batch Orders for Silicon Photonics Chip Bonding Equipment
23 hour ago /
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Author：小编
On September 28, Delong Laser revealed on an interactive platform that its silicon photonics chip bonding equipment is tailored specifically for optical modules operating at 1.6T and beyond. This equipment is characterized by its high technical complexity and stringent production yield standards. Currently, the company has successfully secured small-batch orders for this equipment, though these orders constitute a relatively minor portion of its overall revenue.
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