On September 28th, Nikkei News reported that chipmaker VIS celebrated the grand opening of its first cutting-edge chip manufacturing facility in Singapore on Monday, with plans to construct a second plant already underway. Propelled by the flourishing artificial intelligence infrastructure sector, the new plant's production capacity has swiftly reached full utilization. The wafer fab, christened VSMC, represents a collaborative endeavor between VIS and European chipmaker NXP. Trial production commenced in June, marking an impressive timeline of just 18 months from groundbreaking to trial phase—significantly shorter than the typical construction period exceeding two years. VIS announced that the initial batch of chips achieved a yield rate of at least 99%, with mass production slated to commence in early 2027. Moreover, the facility will support TSMC in manufacturing essential 'interposers' for advanced chip packaging, acting as a foundational platform that interconnects diverse chip types for AI chip producers like NVIDIA, Google, and Broadcom. TSMC, as the principal shareholder of VIS, possesses approximately 19% of its shares.