The Beijing Key Laboratory for High-Speed Optical Interconnection and Computing Technology made its official debut at a forum dedicated to cutting-edge optoelectronic integration technologies and has now set up operations within the Beijing Economic-Technological Development Area. This laboratory, a collaborative effort among North IC Innovation Center (Beijing) Co., Ltd., Beijing Hi-Optel Semiconductor Technology Co., Ltd., Qiming Photonics (Beijing) Technology Co., Ltd., and Peking University, has received formal accreditation. The laboratory will concentrate on three pivotal technologies: heterogeneous integrated silicon photonics chips, on-chip dense wavelength division multiplexing, and advanced silicon photonics packaging. Its goal is to establish a comprehensive research and development framework that encompasses the entire spectrum from device fabrication to system integration and packaging.