Against the backdrop of a global surge in computing power demand, fueled by the rapid advancement of artificial intelligence, a notable trend has emerged within the semiconductor industry: the market value per unit area of cutting-edge DRAM wafers, specifically those designed for DDR5 memory, has now outstripped that of TSMC's most sophisticated 2-nanometer logic wafers. When comparing TSMC's 2nm wafers, which are priced at $30,000 per wafer (equating to roughly $0.424 per square millimeter), with DRAM, it becomes evident that the 1b DRAM boasts a density of 0.436 gigabits per square millimeter. Priced at $1.50 per gigabit, this translates to a per-unit area value of $0.654 per square millimeter, markedly higher than that of the 2nm logic wafers. This disparity can be attributed to the escalating demand for memory chips in AI servers, where memory configurations are 8-10 times greater than those found in traditional servers. Nevertheless, the expansion of memory chip production capacity is hindered by the lengthy construction cycles of clean rooms and bottlenecks in the supply of high-end lithography equipment, exacerbating the widening gap between supply and demand.