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TSMC, the global leader in semiconductor foundry services, is ramping up its efforts to deploy next-generation advanced manufacturing processes. According to the latest industry reports, TSMC’s 1.4-nanometer process, internally codenamed A14, has officially entered the pilot production phase. Trial production is anticipated to commence in 2027, followed by full-scale mass production in 2028. This cutting-edge process leverages a second-generation Gate-All-Around (GAA) transistor architecture, delivering significant improvements over the 2-nanometer process, including an approximate 15% boost in performance, around 20% reduction in power consumption, and roughly 30% increase in transistor density.
TSMC has outlined plans to construct four 1.4-nanometer wafer fabrication plants in the Central Taiwan Science Park, with the total investment expected to surpass US$49 billion.
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