Recently, Credo, a global leader in high-speed interconnects, held a new product launch event, providing detailed insights into its latest technological advancements, product upgrades, supply chain strategies, and medium- to long-term technology roadmap. The event focused on the transformative changes in interconnect architectures driven by the surge in AI computing power. Credo's management team shared in-depth perspectives on key topics, including system-level interconnects, optoelectronic collaborative innovation, capacity assurance, and local market expansion. As a fabless semiconductor company specializing in high-speed connectivity solutions, Credo has developed a comprehensive end-to-end optical strategy encompassing three dimensions: DSP, PIC, and software, complemented by enabling technologies specifically designed for next-generation AI networks. Its ZeroFlap Active Electrical Cables (AECs) and optical modules utilize customized DSPs and software platforms to enable real-time monitoring of optical and electrical links, significantly enhancing the interconnect reliability of AI clusters. Additionally, through acquisitions such as DustPhotonics, Credo has strengthened its in-house silicon photonics chip development capabilities, completing a full-stack layout covering both optical and copper solutions. In terms of supply chain, Credo showcased its robust capacity ramp-up plans, projecting monthly production volumes of hundreds of thousands of units by the end of the current fiscal year, with production rates expected to double or even triple by the end of fiscal year 2028. Meanwhile, Credo is actively expanding its presence in the local market, establishing multiple teams in China to build a comprehensive localized ecosystem for R&D, sales, and technical support.