According to a report issued by the research institution Yole Group, the market size for advanced packaging is projected to exceed US$51 billion by 2031. This figure represents nearly a fivefold increase from the market size in 2025, corresponding to a compound annual growth rate (CAGR) of 27%. In tandem, the CAGR for the number of packaged units is anticipated to reach 33%, while the CAGR for wafer demand is expected to hit 30%. These trends suggest a steady rise in both the complexity and scale of packaging structures.
