The research team from MIT, in collaboration with their partners, has successfully manufactured a transparent and flexible silicon photonic chip on a standard 300-millimeter wafer, employing conventional semiconductor fabrication techniques. The chip's core architecture comprises two layers of silicon nitride waveguides, interposed between layers of silica. The fabrication process involves wafer flipping and the removal of the native silicon substrate, resulting in an exceptionally thin profile—much thinner than a human hair. The chip demonstrates remarkable flexibility and transparency, maintaining stable performance even after undergoing 3,000 bending cycles. Its performance experiences only a marginal decline when bent to the thickness of a toothpick, and it is nearly invisible to the naked eye. The waveguide transmission loss of this chip is comparable to that of traditional rigid silicon-based chips. It can adapt to any curved surface, making it an ideal candidate for applications in AR displays, wearable medical monitoring, and other fields. This innovation effectively addresses the limitations of rigidity and opacity associated with conventional silicon photonic chips. Currently, the technology is still at the laboratory stage and necessitates further performance enhancements. Nevertheless, it boasts a low threshold for mass production and is anticipated to achieve scalable manufacturing by relying on the existing semiconductor industrial infrastructure.