On September 22, BOE A unveiled a report detailing its investor relations activities, announcing that its pilot line dedicated to glass substrate packaging carrier plates has now reached full-scale operation. This line has successfully manufactured 24-layer substrates, each exceeding dimensions of 100×100 millimeters, and these products have successfully passed internal reliability assessments. Presently, the company is working hand-in-hand with customers to carry out electrical performance tests subsequent to chip packaging. This process entails integrating the carrier plates, which are equipped with genuine CPU and GPU chips, into servers for operational testing. The commencement of mass production will hinge on customer order quantities and yield rates, with the investment prerequisites for large-scale production anticipated to be fulfilled in the first half or possibly the first quarter of the upcoming year.